Pattern transferring mold, pattern transferring apparatus and device manufacturing method using the same

The pattern transferring mold used in a pattern transferring apparatus which brings the mold into contact with a photo-curing resin on a substrate and cures the photo-curing resin by light irradiation to transfer a pattern formed in on the mold onto the photo-curing resin, the pattern transferring mold comprising:

• a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area on the periphery of the mold, wherein the pattern-transferring mold has a mold releasing shape in the second area, the mold releasing shape providing a starting area of mold release from the cured photo-curing resin, and wherein the mold-releasing shape has a protruded shape whose height is larger than that of the protruded portions in the pattern.

The pattern transferring mold used in a pattern transferring apparatus which brings the mold into contact with a photo-curing resin on a substrate and cures the photo-curing resin by light irradiation to transfer a pattern formed in on the mold onto the photo-curing resin, the pattern transferring mold comprising:

• a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area on the periphery of the mold, wherein the pattern-transferring mold has a mold releasing shape in the second area, the mold releasing shape providing a starting area of mold release from the cured photo-curing resin, and wherein the second area is an area corresponding to a scribe line that is formed on the photo-curing resin.

A pattern transferring apparatus which brings a pattern transferring mold into contact with a photo-curing resin on a substrate and transfers a pattern formed on the mold onto the photo-curing resin by light irradiation to transfer a pattern formed in on the mold onto the photo-curing resin, the pattern transferring apparatus comprising:

• a pattern transferring mold including a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area on the periphery of the mold, wherein the pattern-transferring mold has a mold releasing shape in the second area, the mold releasing shape providing a starting area of mold release from the cured photo-curing resin, and wherein the mold-releasing shape has a depressed shape whose size is larger than that of the depressed portions in the pattern;
• and an optical system which irradiates a photo curing resin contacting the pattern transferring mold with light.

A pattern transferring apparatus which brings a pattern transferring mold into contact with a photo-curing resin on a substrate and transfers a pattern formed on the mold onto the photo-curing resin by light irradiation to transfer a pattern formed in on the mold onto the photo-curing resin, the pattern transferring apparatus including:

• a pattern transferring mold including a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area on the periphery of the mold;
• and a material supplying unit which supplies material for providing a starting area of mold release from the cured photo-curing resin between the second area and the uncured photo-curing resin;
• wherein the second area is an area corresponding to a scribe line that is formed on the photo-curing resin.

A device manufacturing method comprising:

• preparing a pattern transferring apparatus which brings a pattern transferring mold into contact with a photo-curing resin on a substrate and transfers a pattern formed on the mold onto the photo-curing resin by light irradiation, the pattern transferring apparatus including:
• a pattern transferring mold and an optical system which irradiates a photo-curing resin contacting the pattern transferring mold with light, wherein the pattern-transferring mold includes a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area on the periphery of the mold, wherein the pattern-transferring mold has a mold releasing shape in the second area, the mold releasing shape providing a starting area of mold release from the cured photo-curing resin, and wherein the mold-releasing shape has a depressed shape whose size is larger than that of the depressed portions in the pattern;
• and transferring the pattern onto the photo-curing resin using the pattern transferring apparatus.

A device manufacturing method comprising:

• preparing a pattern transferring apparatus which brings a pattern transferring mold into contact with a photo-curing resin on a substrate and transfers a pattern formed on the mold onto the photo-curing resin by light irradiation, the pattern transferring apparatus including:
• a pattern transferring mold and an optical system which irradiates a photo-curing resin contacting the pattern transferring mold with light, wherein the pattern-transferring mold includes a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area on the periphery of the mold, wherein the pattern-transferring mold has a mold releasing shape in the second area, the mold releasing shape providing a starting area of mold release from the cured photo-curing resin, and wherein the mold-releasing shape has a protruded shape whose height is larger than that of the protruded portions in the pattern;
• and transferring the pattern onto the photo-curing resin using the pattern transferring apparatus.

A device manufacturing method comprising:

• preparing a pattern transferring apparatus which brings a pattern transferring mold into contact with a photo-curing resin on a substrate and transfers a pattern formed on the mold onto the photo-curing resin by light irradiation, the pattern transferring apparatus including:
• a pattern transferring mold and an optical system which irradiates a photo-curing resin contacting the pattern transferring mold with light, wherein the pattern-transferring mold includes a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area on the periphery of the mold, wherein the pattern-transferring mold has a mold releasing shape in the second area, the mold releasing shape providing a starting area of mold release from the cured photo-curing resin, and wherein the second area is an area corresponding to a scribe line that is formed on the photo-curing resin;
• and transferring the pattern onto the photo-curing resin using the pattern transferring apparatus.

A pattern transferring apparatus which brings a pattern transferring mold into contact with a photo-curing resin on a substrate and transfers a pattern formed on the mold onto the photo-curing resin by light irradiation to transfer a pattern formed in on the mold onto the photo-curing resin, the pattern transferring apparatus comprising:

• a pattern transferring mold including a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area on the periphery of the mold, wherein the pattern-transferring mold has a mold releasing shape in the second area, the mold releasing shape providing a starting area of mold release from the cured photo-curing resin, and wherein the mold-releasing shape has a protruded shape whose height is larger than that of the protruded portions in the pattern;
• and an optical system which irradiates a photo curing resin contacting the pattern transferring mold with light.

A pattern transferring apparatus which brings a pattern transferring mold into contact with a photo-curing resin on a substrate and transfers a pattern formed on the mold onto the photo-curing resin by light irradiation to transfer a pattern formed in on the mold onto the photo-curing resin, the pattern transferring apparatus comprising:

• a pattern transferring mold including a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area on the periphery of the mold, wherein the pattern-transferring mold has a mold releasing shape in the second area, the mold releasing shape providing a starting area of mold release from the cured photo-curing resin, and wherein the second area is an area corresponding to a scribe line that is formed on the photo-curing resin;
• and an optical system which irradiates a photo-curing resin contacting the pattern transferring mold with light.