Method and device for measuring bond energy
AssigneeCommissariat a l'Energie Atomique
InventorsFrancois Rieutord, Hubert Moriceau, Benoit Bataillou
Life of this patent
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Abstract
The adhesion between two layers, in particular two thin layers of a microelectronic device, is a data item of importance. It was found that the closure ratio of the interface could be used, in non-destructive manner, to determine a measurement of bond energy. A method and a device using a magnitude characteristic of this length are described, in particular using low incidence X-ray reflection and electronic density at the interface.
Claims18
A non-destructive measurement device for measuring an adhesion energy at an interface between two layers, comprising:
- means for measuring a reflection profile of X-rays according to an angle of incidence of said X-rays on the interface;
- means to determine an electronic density deficit at said interface from said reflection profile;
- means to determine the adhesion energy from electronic density deficit adhesion models between rough surfaces.
A non-destructive method for measuring the adhesion energy at an interface between two layers, comprising:
- measuring a reflection profile of X-rays according to an angle of incidence of said X-rays on the interface;
- determining an electronic density deficit at said interface from said reflection profile;
- determining the adhesion energy from electronic density deficit adhesion models between rough surfaces.
A non-destructive measurement device for measuring an adhesion energy at an interface between two layers, comprising:
- means for measuring a reflection profile of X-rays according to an angle of incidence of said X-rays on the interface;
- means to determine an electronic density deficit at said interface;
- means to determine the adhesion energy from a calibration of said electronic density deficit.
A non-destructive method for measuring the adhesion energy at an interface between two layers, comprising:
- measuring a reflection profile of X-rays according to an angle of incidence of said X-rays on the interface;
- determining an electronic density deficit at said interface from said reflection profile;
- determining the adhesion energy from a calibration of said electronic density deficit.
Dependencies are inferred from the claim text.