Laser chips and vertical external cavity surface emitting lasers using the same
AssigneeSamsung Electronics Co., Ltd.
InventorJun-youn Kim
Life of this patent
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Abstract
Example embodiments may provide an increased efficiency laser chip and/or a vertical external cavity surface emitting laser (VECSEL) using the same. Example embodiment laser chips may include a substrate; a DBR (distributed Bragg reflector) layer on the substrate, an active layer on the DBR layer having multiple quantum wells excited by a pump beam to generate light, and/or an upper coating layer on the active layer by alternately stacking first and second layers each having different refractive indexes. Thicknesses of the first and second layers may be substantially equal to a quarter of a wavelength of light generated by the active layer.
Claims19
A laser chip comprising:
- a substrate;
- a Distributed Bragg Reflector (DBR) layer on the substrate;
- an active layer on the DBR layer, the active layer having a plurality of quantum wells configured to generate light if excited by a pump beam;
- a heat spreader in contact with a layer of the laser chip, the layer of the laser chip not including the active layer, the heat spreader being thermally conductive and optically transmissive;
- and
- an upper coating layer on the active layer, the upper coating layer including, at least one first layer having a first refractive index and a thickness of about one-fourth of a wavelength of the light generated by the active layer, and
- at least one second layer having a second refractive index and a thickness of about one-fourth of a wavelength of the light generated by the active layer, the at least one second layer being alternately stacked with the at least one first layer.
Dependencies are inferred from the claim text.