Low application temperature hot melt adhesive
AssigneeHenkel AG & Co. KGaA
InventorsCharles W. Paul, Matthew L. Sharak, Leisa A. Ryan, Maria Xenidou, Michael G. Harwell, Qiwei He
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Abstract
A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
Claims15
A nonwoven article manufactured using a hot melt adhesive composition applied at a temperature of below 120° C., said adhesive composition comprising
- a styrene block copolymer and
- a type and amount of wax effective to produce an adhesive having a viscosity at 120° C. of below 10,000 centipoises, a cube flow at 54° C. of less than 300%, a DSC crystallization temperature of less than 75° C., and a storage modulus of less than 1.0×107 dynes/cm2 at 10 rads/sec (25° C.),
- wherein the styrene block copolymer is present in amounts of from 10 to 25 wt % and said effective amount of wax is less than 10 wt %.
Dependencies are inferred from the claim text.