Reduction in thickness of semiconductor component on substrate
AssigneeInternational Business Machines Corporation
InventorsToshihiko Nishio, Yasumitsu Orii, Yukifumi Oyama
Life of this patent
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Abstract
It is an object to reduce a thickness of a semiconductor component (chip) on a substrate to a predetermined thickness regardless of a variation in thickness of a substrate in a semiconductor product. In a semiconductor product mounted on a base plate, a surface of a semiconductor component on a substrate is set to be located at a predetermined height h from a surface of a base plate. Thereafter, through machining the surface of the semiconductor component which is adjusted to be located at the predetermined height, it is possible to make the thickness of the semiconductor component on the substrate equal to a predetermined thickness.
Claims13
A method for reducing a thickness of a semiconductor component on a substrate, the method comprising the steps of:
- preparing a base plate;
- preparing a substrate on which a semiconductor component is mounted;
- preparing a fixation device including a bottom portion and leg portions, in which a distance between a surface of the bottom portion and an end surface of each of the leg portions has a predetermined length;
- temporarily tacking the substrate to the fixation device using a first fixing material that is made of a light-curable material so that a surface of the semiconductor component may join the surface of the bottom portion of the fixation device;
- placing the fixation device to which the substrate is temporarily tacked onto a surface of the base plate, and further temporarily tacking a surface of the substrate on the side where the semiconductor component is not mounted to the surface of the base plate using a second fixing material that is made of a light-curable material;
- releasing the temporary tacking between the fixation device and the semiconductor component, and removing the fixation device from the surface of the base plate;
- machining the exposed surface of the semiconductor component on the base plate;
- and
- releasing the temporary tacking between the substrate after being machined and the surface of the base plate, and separating the substrate and the base plate from each other.
A method for reducing a thickness of a semiconductor component on a substrate, the method comprising the steps of:
- preparing a base plate;
- preparing a substrate on which a semiconductor component is mounted;
- preparing a fixation device including a bottom portion and leg portions, in which a distance between a surface of the bottom portion and an end surface of each of the leg portions has a predetermined length, the bottom portion of the fixation device having at least one opening;
- temporarily tacking the substrate to the fixation device and further joining the surface of the semiconductor component to the surface of the bottom portion of the fixation device by aspirating the surface of the semiconductor component via the opening in the bottom potion of the fixation device;
- placing the fixation device to which the substrate is temporarily tacked onto a surface of the base plate, and further temporarily tacking a surface of the substrate on the side where the semiconductor component is not mounted to the surface of the base plate using a second fixing material that is made of a light-curable material;
- releasing the temporary tacking between the fixation device and the semiconductor component, and removing the fixation device from the surface of the base plate;
- machining the exposed surface of the semiconductor component on the base plate;
- and
- releasing the temporary tacking between the substrate after being machined and the surface of the base plate, and separating the substrate and the base plate from each other.
Dependencies are inferred from the claim text.