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US 7,682,879 B2Granted
Edge coating a microelectronic device
AssigneeSeagate Technology LLC
InventorsRobert Michael Echols, Michael Richard Fabry
Life of this patent
Estimating the term…
Abstract
A microelectronic device includes a die having an active surface and a non-active surface. To assemble the microelectronic device, the active surface of the die is placed on a substrate. A first material is dispensed between the active surface of the die and the substrate. A second material is dispensed on at least a portion of the non-active surface of the die. The second material is different than the first material and the first material and the second material are simultaneously cured.
Claims18
A method of assembling a microelectronic device comprising:
- providing a die having an active surface, an opposing non-active surface substantially parallel with the active surface and a plurality of sidewalls positioned about a perimeter of the die connecting the active and the non-active surfaces, the plurality of sidewalls intersect with the non-active surface to form non-active side edges;
- placing the active surface of the die on a substrate;
- dispensing a first material at least between the active surface of the die and the substrate, the first material having adhesive properties including a first resin and a non-conductive first filler;
- dispensing a second material on at least a portion of the non-active surface of the die and on at least a portion of the first material to cover the non-active side edges of the die, the second material is in contact with the first material and leaves at least a portion of the non-active surface exposed to a surrounding environment of the die, the second material having thixotropic properties including a second resin and a non-conductive second filler;
- and
- simultaneously curing the first material and the second material.
3 more elements
A microelectronic device comprising:
- a die having an active surface an opposing a non-active surface substatially parallel with the active surface and a plurality of sidewalls positioned about a perimeter of the die connecting the active and non-active surfaces and forming non-active side edges where the sidewalls meet with the non-active surface, the active surface of the die configured to be placed on a substrate;
- an underfill material deposited at least between the active surface of the die and the substrate, the underfill material having adhesive properties including a first resin and a non-conductive first filler;
- a second material deposited on at least a portion of the non-active surface of the die to cover the non-active side edges of the die and leave at least a portion of the non-active surface exposed to a surrounding environment of the die, the second material in contact with the non-conductive underfill material and having thixotropic properties including a second resin and a non-conductive second filler;
- and
- wherein the underfill material and the second material are simultaneously cured.
2 more elements
A microelectronic device comprising:
- a semiconductor die including:
- a non-active surface;
- an opposing active surface substantually parallel with the non-active surface and configured to be placed on a substrate;
- a plurality of sidewalls positioned about a perimeter of the die and connecting the active and non-active surfaces, the plurality of sidewalls intersect with the non-active surface and the active surface to form side edges of the die;
- a first material having adhesive properties including a first resin and a first filler, the first material dispensed between the active surface of the semiconductor die and the substrate;
- a second material having thixotropic properties including a second resin and a second filler, the second material dispensed to coat all side edges of the semiconductor die and at least a portion of the non-active surface such that none of the edges of the die are left exposed to the surrounding environment of the die and at least a portion of the non-active surface is left exposed to the surrounding environment;
- and
- wherein the first material and the second material are in contact and are simultaneously cured.
5 more elements
An apparatus comprising:
- a die having a non-active surface and an opposing active surface that is configured to be placed in electrical communication with a substrate;
- an electrically non-conductive underfill material also operably extending outwardly from a sidewall of the die and covering an active edge of the die;
- a second material operably supported by the underfill material and not contactingly engaging the substrate, the second material operably covering a non-active side edge of the die but leaving at least a portion of the non-active surface exposed to a surrounding environment of the die and leaving a least a portion of the underfill material exposed to the surrounding environment of the die.
Dependencies are inferred from the claim text.