Encapsulation circuitry on a substrate
AssigneeMedtronic, Inc.
InventorsDavid A. Ruben, Scott B. Sleeper, Peter C. Tortorici
Life of this patent
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Abstract
An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.
Claims10
A method of manufacturing a circuit board assembly comprising:
- providing a substrate having a top surface with a circuit component region adapted to mount a component having a height dimension that extends above the substrate top surface,
- providing a substantially planar frame having a substantially planar bottom side surface and a substantially planar top side surface, the frame having a thickness, the frame further having a continuous wall that defines a hole formed through the thickness of the frame, the continuous wall extending from the top surface to the bottom surface through the thickness of the frame,
- stacking the frame and the substrate on top of one another such that the hole in the frame surrounds the circuit component,
- attaching the substantially planar bottom side surface of the frame to the top surface of the substrate,
- the frame being of a thickness, such that upon stacking the frame and the substrate, the hole forms a well having a depth that is equal to or greater than a height dimension of a component mounted to the substrate top surface, and
- filling the well formed by the hole with a protective material to encapsulate a component mounted to the substrate top surface.
Dependencies are inferred from the claim text.