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US 7,682,877 B2Granted
Substrate based unmolded package
AssigneeFairchild Semiconductor Corporation
InventorsRajeev Joshi, Jonathan A. Noquil, Consuelo N. Tangpuz
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Abstract
A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a leadframe structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead. The die attach surface and the lead surface can be in different planes.
Claims14
A method comprising:
- providing a leadframe structure including a die attach region with a die attach surface and a lead including a lead surface;
- stamping the leadframe structure so that the lead surface and the die attach surface lie in different planes;
- forming a substrate, wherein forming the substrate comprises forming a molding material around the leadframe structure and on the lead and around the lead surface to thereby expose the lead surface;
- attaching a semiconductor die to the die attach region of the leadframe structure in the substrate;
- and
- placing a conductive structure on the lead surface.
3 more elements
Dependencies are inferred from the claim text.