Method for fabricating a module including a sintered joint
AssigneeInfineon Technologies AG
InventorsKarsten Guth, Ivan Nikitin
Life of this patent
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Abstract
A method comprises applying a paste comprising metal grains, a solvent, and a sintering inhibitor to one of a die and a metal layer. The method comprises evaporating the solvent in the paste and placing the one of the die and the metal layer on the other of the die and the metal layer such that the paste contacts the die and the metal layer. The method comprises applying a force to the one of the die and the metal layer and decomposing the sintering inhibitors to form a sintered joint joining the die to the metal layer.
Claims19
A method for fabricating a module, the method comprising:
- applying a paste comprising metal grains, a solvent, and a sintering inhibitor to a die;
- evaporating the solvent in the paste;
- heating a substrate comprising a metal layer in a non-oxidizing atmosphere;
- placing the die on the heated metal layer such that the paste contacts the heated metal layer;
- and
- applying a force to one of the die and the metal layer to form a sintered joint joining the die to the metal layer.
A method for fabricating a module, the method comprising:
- applying a paste comprising metal grains, a solvent, and a sintering inhibitor to a semiconductor chip;
- drying the paste to evaporate the solvent;
- heating a substrate comprising a metal surface in a non-oxidizing atmosphere;
- placing the semiconductor chip on the heated metal surface such that the paste contacts the heated metal surface;
- and
- applying a force to the semiconductor chip to form a sintered joint joining the semiconductor chip to the metal surface.
Dependencies are inferred from the claim text.