Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
AssigneeChipPAC, Inc.
InventorMarcos Karnezos
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Abstract
A semiconductor multi-package module having stacked second and first packages, each package including a die attached to a substrate, in which the first and second package substrates are interconnected by wire bonding, and in which the first package is a flip chip ball grid array package in a die-down configuration. Also, a method for making a semiconductor multi-package module, by providing a first package including a first package substrate and having a die-down flip chip configuration, affixing a second package including a second package substrate an upper surface of the first package, and forming z-interconnects between the first and second package substrates.
Claims19
A method for making a multi-package module, comprising:
- providing a first package including a die-down flip chip and a first package substrate,
- providing a second package including a wire bonded die, at least as large as the die-down flip chip, electrically connected at two sides to a second package substrate in which the wire bonded die is enclosed in a first encapsulant,
- stacking the second package over the first package,
- electrically interconnecting the first and second packages by wire bonds connecting the first package substrate and the second package substrate at two sides, and
- molding a second encapsulant to enclose the second package, including the first encapsulant, and the wire bonds.
Dependencies are inferred from the claim text.