Integrated circuit package system with underfill
AssigneeSTATS ChipPAC, Ltd.
InventorsSooMoon Park, Tae Keun Lee, YoRim Lee
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes: providing a package carrier; forming a first channel in the package carrier; mounting a first integrated circuit device over the package carrier and adjacent to the first channel; mounting a second integrated circuit device over the package carrier and adjacent to the first channel; and forming a contiguous underfill fillet with the first channel and under both the first integrated circuit device and the second integrated circuit device.
Claims18
A method of manufacturing an integrated circuit package system comprising:
- providing a package carrier;
- forming a first channel in the package carrier;
- forming a second channel in contact with the first channel;
- mounting a first integrated circuit device over the package carrier and adjacent to the first channel;
- mounting a second integrated circuit device over the package carrier and adjacent to the first channel and the second channel;
- and
- forming a contiguous underfill fillet with the first channel and under both the first integrated circuit device and the second integrated circuit device.
A method for manufacturing an integrated circuit package system comprising:
- providing a package carrier;
- forming a first channel in contact with a second channel in the package carrier with the second channel substantially perpendicular to the first channel;
- mounting a first integrated circuit device over the package carrier and adjacent to the first channel;
- mounting a second integrated circuit device over the package carrier and adjacent to the first channel and the second channel;
- and
- forming a contiguous underfill fillet over the first channel and the second channel and under both the first integrated circuit device and the second integrated circuit device.
An integrated circuit package system comprising:
- a package carrier having a first channel and a second channel in contact with the first channel;
- a first integrated circuit device mounted over the package carrier and adjacent to the first channel;
- a second integrated circuit device mounted over the package carrier and adjacent to the first channel and the second channel;
- and
- a contiguous underfill fillet over the first channel and under both the first integrated circuit device and the second integrated circuit device.
Dependencies are inferred from the claim text.