Method of packaging integrated circuit devices using preformed carrier
AssigneeMicron Technology, Inc.
InventorTan Kwang Hong
Life of this patent
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Abstract
Disclosed is a method of packaging integrated circuit devices using a preformed carrier. In one illustrative embodiment, the method includes providing a carrier having a plurality of pockets formed therein, positioning an integrated circuit chip and a substrate in each of the plurality of pockets and conductively coupling the integrated circuit chip and the substrate in each of the plurality of pockets to one another. Also disclosed is a packaged integrated circuit device including a preformed body and an integrated circuit chip and a substrate positioned within the preformed body, the integrated chip and the substrate being conductively coupled to one another.
Claims20
A method, comprising:
- providing a carrier having a plurality of pockets formed therein, each pocket comprising a first recess and a second recess, the second recess being positioned above the first recess;
- positioning an integrated circuit chip in the first recess of each of the plurality of pockets with an active surface facing out of the first recess;
- positioning a substrate in the second recess, the substrate having an active surface facing out of the second recess, the substrate having a slot;
- and
- conductively coupling the integrated circuit chip to the substrate with wire bonds extending through the slot.
A method, comprising:
- providing a carrier having a plurality of pockets formed therein, wherein each of the pockets comprises a first recess and a second recess;
- for each of the pockets, positioning an integrated circuit chip in the first recess with an active side facing away from the pocket, and positioning a substrate in the second recess with an active side facing away from the pocket, the substrate having a slot;
- and
- forming an electrical connection between the integrated circuit chip and the substrate in each of the plurality of pockets to one another, the electrical connection extending through the slot.
Dependencies are inferred from the claim text.