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US 7,682,862 B2Granted
Image sensor and method for manufacturing the same
AssigneeDongbu HiTek Co., Ltd.
InventorJeong-Su Park
Life of this patent
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Abstract
A method for manufacturing an image sensor that can include forming a pad electrode over a semiconductor substrate; forming a protective layer over the pad electrode; forming a via hole through the protective layer to expose a portion of the uppermost surface of the pad electrode; and then forming a gold layer over the exposed portion of the uppermost surface of the pad electrode.
Claims14
A method comprising:
- providing a semiconductor substrate including a pixel array region and a logic circuit region;
- forming a dielectric layer composed of a first oxide material over the semiconductor substrate;
- forming a pad electrode over and directly contacting the dielectric layer in the logic circuit region;
- forming a protective layer composed of a second oxide material over and directly contacting the pad electrode and the dielectric layer;
- forming a via hole by selectively removing portions of the protective layer to expose a portion of the uppermost surface of the pad electrode;
- forming a metal layer over and directly contacting the exposed portion of the uppermost surface of the pad electrode such that the thickness of the metal layer is less than the depth of the via hole;
- forming a color filter over and directly contacting the protective layer in the pixel array region after forming the metal layer;
- and then
- forming a plurality of microlenses over the color filter.
6 more elements
A method comprising:
- forming a first oxide layer over a semiconductor substrate;
- forming a pad electrode over the semiconductor substrate and directly contacting the first oxide layer;
- forming a second oxide layer over and directly contacting the pad electrode and the first oxide layer;
- forming a via hole through the second oxide layer to expose a portion of the uppermost surface of the pad electrode;
- and then
- forming a gold layer in the via hole over and contacting the exposed portion of the uppermost surface of the pad electrode such that a plane of the uppermost surface of the gold layer is below a plane of the uppermost surface of the second oxide layer forming a color filter over and directly contacting the second oxide layer in a pixel array region after forming the gold layer;
- and then forming a plurality of microlenses over the color filter.
4 more elements
Dependencies are inferred from the claim text.