Transparent member, optical device using transparent member and method of manufacturing optical device

A method of manufacturing an optical device, comprising the steps of:

• mounting a chip as an optical element to a substrate;
• fixing a protecting member to said substrate so as to surround said chip;
• and
• attaching a transparent member to a top surface of said protecting member, wherein
• said step of attaching said transparent member includes the steps of
• molding one molded body having a plurality of transparent members, one of said plurality of transparent members being arranged at a corresponding one of a plurality of regions sectioned by phantom lines in a grid pattern;
• and
• dividing said one molded body along said phantom lines to form each of said plurality of transparent members, wherein
• said one molded body comprises a double-faced sheet having a base material, a temporary adhesive layer attached to one side of said base material and an actual adhesive layer attached to the other side of said base material and to said transparent member, and is cut along said phantom lines with said temporary adhesive layer temporarily fixed to another member;
• after said plurality of transparent members are formed, each of said plurality of transparent members is removed from said base material;
• and
• said transparent member is then bonded to the top surface of said protecting member by said actual adhesive layer.

A method of manufacturing an optical device comprising a substrate, a chip as an optical element mounted to said substrate, a protecting member provided at said substrate so as to surround said chip and a transparent member attached to a top surface of said protecting member, comprising the steps of:

• preparing a whole substrate having a plurality of regions which can be sectioned by phantom lines in a grid pattern to correspond to a plurality of substrates, respectively;
• mounting a plurality of chips to said plurality of regions, respectively;
• integrally attaching a whole protecting member having a plurality of protecting members to said whole substrate;
• preparing one molded body having a plurality of transparent members arranged at the plurality of regions, respectively, sectioned by said phantom lines in a grid pattern;
• forming one intermediate body by attaching said one molded body to a top surface of said whole protecting member through an adhesive layer;
• and
• dividing said one intermediate body along said phantom lines in said grid pattern to form a plurality of optical devices each having said substrate, said protecting member, said transparent member and said chip.

A method of manufacturing an optical device comprising a substrate, a chip as an optical element mounted to said substrate and a sealing member provided at said substrate for the purpose of sealing said chip and functioning as a lens, comprising the steps of:

• preparing a whole substrate having a plurality of regions which can be sectioned by phantom lines in a grid pattern to correspond to a plurality of substrates, respectively;
• mounting a plurality of chips to said plurality of regions, respectively;
• attaching said whole substrate to a mold surface of an upper mold;
• forming a molten resin material by heating in a cavity including a plurality of concave portions, said plurality of concave portions provided on a mold surface of a lower mold opposite to said mold surface of said upper mold so as to correspond to said plurality of chips and having a shape of a lens respectively, or introducing a liquid resin material at a room temperature into said cavity;
• immersing said plurality of chips into said molten resin material or said liquid resin material by closing said upper mold and said lower mold, and thereby forming one intermediate body by integrally providing a whole sealing member having a plurality of sealing members respectively enclosing said plurality of chips at said whole substrate;
• and
• dividing said one intermediate body along said phantom lines in said grid pattern to form a plurality of optical devices each having said substrate, said sealing member and said chip.