Gallium oxide-zinc oxide sputtering target, method for forming transparent conductive film, and transparent conductive film
AssigneeNippon Mining & Metals Co., Ltd.
InventorKozo Osada
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AssigneeNippon Mining & Metals Co., Ltd.
InventorKozo Osada
Estimating the term…
Provided is a high density gallium oxide-zinc oxide series sintered body sputtering target for forming a transparent conductive film containing 20 to 2000 mass ppm of zirconium oxide. In a gallium oxide (Ga2O3)-zinc oxide (ZnO) series sputtering target (GZO series target) for forming a transparent conductive film, trace amounts of specific elements are added to obtain a target capable of improving the conductivity and the bulk density of the target; in other words, capable of improving the component composition to increase the sintered density, inhibit the formation of nodules, and prevent the generation of an abnormal electrical discharge and particles. Also provided are a method for forming a transparent conductive film using such a target, and a transparent conductive film formed thereby.
A gallium oxide-zinc oxide series sintered body sputtering target for forming a transparent conductive film containing 20 to 2000 mass ppm of zirconium oxide and having a sintered density of 5.55 g/cm3 or higher.
A transparent conductive film consisting of gallium oxide-zinc oxide and 20 to 2000 mass ppm of zirconium oxide formed on a substrate with sputtering.
A transparent conductive film formation method comprising the step of forming a thin film formed from gallium oxide-zinc oxide containing 20 to 2000 mass ppm of zirconium oxide on a substrate by performing sputtering with a gallium oxide-zinc oxide series target containing 20 to 2000 mass ppm of zirconium oxide and having a sintered density of 5.55 g/cm3 or higher to deposit the thin film onto the substrate.
Dependencies are inferred from the claim text.