Lead-free solder alloy
AssigneeSenju Metal Industry Co., Ltd.
InventorsOsamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima
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Abstract
A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
Claims9
A lead-free solder alloy consisting of 0.1-1.5 wt % of Cu, 0.003-0.01 wt % of P, 0.3-3 wt % of Ag, 0-0.1 wt % of Ge, a total of 0-0.5 wt % of at least one of Ni, Co, Fe, Mn, Cr, and Mo, and a balance of Sn.
Dependencies are inferred from the claim text.