Adhesion promotion in printed circuit boards

An adhesion promotion composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board, the adhesion promotion composition comprising a corrosion inhibitor, an inorganic acid, an oxidizing agent, chloride ion in a concentration between 20 ppm and 100 ppm, an alcohol which is effective to increase copper-loading in the composition wherein the alcohol is dihydric or trihydric, and an anionic surfactant, wherein the adhesion promotion composition is initially substantially free of transition metals having a tendency to destabilize the oxidizing agent.

An adhesion promotion composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board, the adhesion promotion composition comprising a corrosion inhibitor, an inorganic acid, an oxidizing agent, chloride ion in a concentration between 20 ppm and 100 ppm, and a polyhydric alcohol or an ether thereof, which polyhydric alcohol or ether thereof is effective to increase copper-loading in the composition, wherein the inorganic acid is a mixture of sulfuric acid and nitric acid and constitutes between about 22 and about 28 wt % of the composition.

An adhesion promotion composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board, the adhesion promotion composition comprising a corrosion inhibitor, an inorganic acid, an oxidizing agent, chloride ion in a concentration between 20 ppm and 100 ppm, and a polyhydric alcohol or an ether thereof, which polyhydric alcohol or ether thereof is effective to increase copper-loading in the composition, wherein the inorganic acid is a mixture of sulfuric acid and nitric acid and constitutes at least about 30 wt % of the composition.