Burn-in socket
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsLiang Gao, Ming-Yue Chen, Jia-Jia Cai, Zhen-Qi Yang, Sung-Pei Hou
Life of this patent
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AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsLiang Gao, Ming-Yue Chen, Jia-Jia Cai, Zhen-Qi Yang, Sung-Pei Hou
Estimating the term…
A burn-in socket includes a base, a sliding plate mounted to the base and having a number of pin holes, a number of contacts secured to the base and an actuator mounted on the base. The contacts each comprise a base portion and a pair of arms received in the pin holes of the sliding plate. The actuator includes a frame and a number of actuating portion for driving the sliding plate to move in a transversal direction. The sliding plate includes a number of projections adjacent to contacts. Each projection and the pair of arms of an adjacent contact together define a receiving space and located at three sides of the receiving space, respectively.
A burn-in socket comprising:
A burn-in socket for testing an IC package with solder balls, comprising:
A burn-in socket for use with an electronic package having solder balls on one undersurface, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Details: concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
External aspects, e.g. related to chambers, contacting devices or handlers: contacting devices, e.g. sockets, burn-in boards or mounting fixtures
Measuring electric variables
About 2 years 9 months of term left · ends 4 Aug 2029 (estimated)
1. Field of the Invention
The present invention relates to a burn-in socket, and more particularly to a burn-in socket mounted on a printed circuit board (PCB) for testing an IC package.
2. Description of Prior Art
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
FIG. 1 is an assembled, perspective view of a burn-in socket in accordance with a preferred embodiment of the present invention;
FIG. 2 is an exploded, perspective view of the burn-in socket shown in FIG. 1;
Referring to FIGS. 1-2, a burn-in socket 1 in accordance with a preferred embodiment of the present invention is generally mounted to a printed circuit board (not shown) to receive and test an IC package (not shown). The burn-in socket 1 includes a socket body 2, a plurality of contacts 4 mounted to the socket body 2, and an actuator 3 movably mounted upon the socket body 2. The IC package is put into the socket body 2 to be tested.
Referring to FIGS. 3-4, the contact 4 includes a middle base portion 40, a pair of testing arms respectively extending upwardly from the base portion 40, and a tail portion 43 extending downwardly from the base portion 40. The pair of testing arms includes a fixed ram 41 with a linear configuration and a moving arm 42 movable relative to the stationary arm 41. The top ends of the testing arms are respectively formed with tip portions so as to jointly clip one solder ball 80 (shown in FIG. 4) of the IC package in a first direction.
Particularly referring to FIGS. 2-4, the socket body 2 includes a base 20, a positioning frame 24 received in the base 20, a sliding plate 21 disposed on the positioning frame 24, a bottom plate 22 fixed to bottom side of the base 20, and a pair of locking elements 23 to jointly lock the IC package loaded on the sliding plate 21. The bottom plate 22, the base 20, and the sliding plate 21 respectively define a plurality of pin holes 220, 200, 210, extending therethrough for the contacts 4 passing through. The base portion 40 is retained in the pin holes 200 of the base 20, and the tip portions extend out of the pin holes 210 of the sliding plate 21, while the tail portion 43 extends downwardly and out of the pin hole 220 of the bottom plate 22.