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US 7,682,140 B2Granted
Mold for resin molding, resin molding apparatus, and semiconductor device manufacture method
AssigneeFujitsu Microelectronics Limited
InventorsFutoshi Fukaya, Yoshitsugu Katoh
Life of this patent
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Abstract
A mold includes a pot for accommodating resin, a cavity for accommodating a semiconductor chip to be resin-molded and a runner as a resin passage for transporting the resin accommodated in the pot to the cavity. A foreign matter retention pocket is disposed which is a recess formed by digging further a partial inner surface of the runner. A runner magnet attracts and attaches a metallic foreign matter contained in fluid transported in the runner to the inner surface of the foreign matter retention pocket.
Claims5
A mold for resin molding comprising:
- a pot for accommodating resin;
- a cavity for accommodating a resin molding target;
- a runner for transporting the resin accommodated in the pot to the cavity;
- a foreign matter retention pocket disposed at a bottom of the runner and being a recess;
- and
- a first magnet disposed at a position below a bottom surface of the foreign matter retention pocket.
3 more elements
A mold for resin molding comprising:
- a pot for accommodating resin;
- a cavity for accommodating a resin molding target;
- a runner for transporting the resin accommodated in the pot to the cavity;
- a foreign matter retention pocket disposed in the runner near the pot;
- and
- an ejector pin disposed in the cavity, wherein at least a projection portion of the ejector pin in the cavity is magnetized.
3 more elements
Dependencies are inferred from the claim text.