Backlight module with a heat dissipation device
AssigneeCoretronic Corporation
InventorsNien-Hui Hsu, Ching-Po Lee
Life of this patent
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AssigneeCoretronic Corporation
InventorsNien-Hui Hsu, Ching-Po Lee
Estimating the term…
A backlight module including a light box, a plurality of light source sets, and a heat dissipation device is provided. The light box has a bottom and a light-emitting section. The bottom has a first surface and a second surface opposite to the first surface. The light source sets are disposed on the first surface, and each of the light source sets includes a substrate disposed on the first surface and a plurality of point light sources disposed on the substrate. The heat dissipation device is disposed on the second surface. The heat dissipation device includes a thermal assembly and at least one fan, and the thermal assembly includes a plurality of covers. Each of the covers is individually disposed on the second surface at a position below one of the light source sets, and an air flow channel is formed between each cover and the bottom.
A backlight module, comprising:
A backlight module, comprising:
Dependencies are inferred from the claim text.