Electronic assembly remanufacturing system and method
AssigneeCaterpillar Inc.
InventorsPaul C Gottshall, Ernesto Nicanor Santillan Guerrero
Life of this patent
Estimating the term…
Loading patent…
AssigneeCaterpillar Inc.
InventorsPaul C Gottshall, Ernesto Nicanor Santillan Guerrero
Estimating the term…
A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a portion of the housing. The opened electronic assembly is lowered onto a desoldering fixture having a plurality of solder pots configured to encompass, and thus desolder, the solder joints associated with the component that is affixed to a portion of the housing. Once the affected solder joints are melted, the remaining portion of the housing and the component affixed thereto may be lifted away, exposing the top surface of the circuit assembly for analysis, repair, and or adjustment.
A method for remanufacturing an electronic assembly, the assembly including a housing having therein a circuit assembly comprising a plurality of components, at least one of which is affixed to a portion of the housing, the method comprising:
A method of using and processing an engine control unit having a housing and a circuit assembly therein comprising a plurality of components, at least one of which is affixed to a portion of the housing, the method comprising:
Dependencies are inferred from the claim text.