Apparatus for manufacturing bonded substrate
AssigneeFujitsu Limited
InventorsKoji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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AssigneeFujitsu Limited
InventorsKoji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
Estimating the term…
The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.
A liquid crystal drip device used in manufacture of a bonded substrate from a first substrate and a second substrate, the liquid crystal drip device comprising:
A liquid crystal drip device used in manufacture of a bonded substrate from a first substrate and a second substrate, the liquid crystal drip device comprising:
A liquid crystal drip device used in manufacture of a bonded substrate from a first substrate and a second substrate, the liquid crystal drip device comprising a dispenser configured to drip a liquid crystal on at least either one of the first and second substrates, wherein the dispenser includes:
Dependencies are inferred from the claim text.