Method for fabricating double-sided wiring board

A method for fabricating a double-sided wiring board for mounting an electronic component thereon comprising metal wiring patterns formed both on upper and lower sides of an electrically-insulating board, the method comprising in the following order:

• laminating a metal layer with a support substrate on both side of the electrically-insulating board, the metal wiring patterns being formed by the metal layer;
• forming a through-hole and/or a blind via-hole in the electrically-insulating board through the metal layer with the support substrate on at least one side of the electrically-insulating board after said laminating;
• removing the support substrate from the metal layer after said forming so that the metal layer is left on the electrically-insulating board;
• and
• electrically connecting the metal wiring patterns to each other through the through-hole and/or the blind via-hole after said removing said support substrate,
• wherein the metal layer with the support substrate comprises a carrier layer of a metal material, a release layer formed on the carrier layer, and the metal layer formed on the release layer, and
• wherein the metal layer is bonded to the electrically-insulating board.