RFID silicon antenna

The method of producing a Radio Frequency Identification (RFID) antenna as an integral part of an RFID integrated circuit using silicon as antenna material thereby enabling the antenna and integrated circuit to be manufactured as one piece, said method comprising:

• providing commercially produced bulk sheets of silicon wafer base material (silicon wafers);
• femtosecond laser ablating, with a sharply focused pulse, the silicon wafers to create three dimensional nano structures out of the silicon base material;
• designing the antenna as a complex resonant antenna at a macro level and reducing it through a process of de-magnification or photographically to a nano sized image which perfectly replicates design features of a macro level template directional antenna on a master stencil mask and, still further,
• forming this structure on the reverse side of silicon wafers treated with femtosecond laser ablation;
• manufacturing said femtosecond laser ablation silicon wafers into radio frequency identification antennas and whereby the individual wafers are applied, using standard semiconductor industry layering method, onto a semiconductor to be used in an RFID system.