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US 7,679,982 B2Granted
Multi-die packaged device
AssigneeHynix Semiconductor Inc.
InventorSang Hwa Chung
Life of this patent
Estimating the term…
Abstract
A packaged multi die device includes at least one memory die. The one or more of the memory dice includes a memory function circuit configured to program or read data, a logic circuit configured to control the program operation and the read operation of the memory function circuit in accordance with an inputted operation command, and a power supplying circuit configured to provide a power corresponding to an operation mode to the memory function circuit, and apply an extra power to the logic circuit.
Claims7
A multi-die packaged device comprising:
- at least one memory die,
- wherein the memory die includes:
- a memory function circuit configured to program or read data;
- a logic circuit configured to control the program operation and the read operation of the memory function circuit in accordance with an inputted operation command;
- a power circuit configured to provide a first power to the memory function circuit according to an operation mode;
- a reference voltage providing circuit configured to provide a reference voltage for operating the power circuit;
- and
- a logic power circuit configured to provide a second power to the logic circuit in a standby mode and an active mode so that the logic circuit senses an operation command during the standby mode.
5 more elements
A packaged multi-die device comprising:
- first and second memory dice,
- wherein a first power corresponding to an operation mode is applied to the first memory die selected for a program operation or a read operation of the memory dice, and
- wherein a second power is provided to a logic circuit for operation control in the second memory die that is not selected, so that the logic circuit of the second memory die senses an operation command during a standby mode.
Dependencies are inferred from the claim text.