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US 7,679,917 B2Granted
Electronic assembly cooling
OwnerJoseph F. Deck, Bradley L. Hunter +2inventors
InventorsJoseph F. Deck, Bradley L. Hunter, Michael B. Nussbaum, Steven D. Owen
Life of this patent
Estimating the term…
Abstract
An electronic assembly including a first heat producing device mounted on a first outer surface of a first portion of a circuit board. The first portion can deflect upwardly and downwardly relative to other portions of the circuit board. A first force element urges the first heat producing device against a heat sink. The force exerted by the first force element is variable with respect to time.
Claims20
An electronic assembly, comprising:
- a first heat producing device mounted on a first outer surface of a first portion of a circuit board, wherein the first portion can deflect upwardly and downwardly relative to other portions of the circuit board;
- and
- a first force element for urging the first heat producing device against a heat sink, wherein the force exerted by the first force element is variable with respect to time, wherein the first force element has a property that if subjected to a temperature of 125° C. for 1522 hours, the first force element exerts a pressure that is less than 75% of and at least 33% of an initial pressure.
An electronic assembly, comprising:
- a first heat producing device mounted on a first outer surface of a first portion of a circuit board, wherein the first portion can deflect upwardly and downwardly relative to other portions of the circuit board;
- a first force element for urging the first heat producing device against a heat sink, wherein the force exerted by the first force element is variable with respect to time
- a second heat producing device mounted on a first outer surface of a second portion of the circuit board;
- wherein the first and second portions can deflect upwardly and downwardly relative to each other and to other portion of the circuit board;
- and
- a second force element for urging the second heat producing device against a heat sink;
- wherein the force exerted by the second force element is variable with respect to time;
- and
- wherein the first force element and the second force element are different areas of a compressible pad.
6 more elements
An audio amplifier, comprising:
- a first power amplifier chip mounted on a first outer surface of a first portion of a circuit board;
- a second power amplifier chip mounted on the first outer surface of a second portion of the circuit board so that the first portion and the second portion can deflect upwardly and downwardly relative to each other;
- and
- a force source comprising a non-metallic material adjacent a second outer surface of a circuit board to urge the first power amplifier chip and the second amplifier chip against a heat sink with a force that is variable with respect to time,
- wherein the force source has a property that if subjected to a temperature of 125° C. for 1522 hours, the force element exerts a pressure that is less than 75% and at least 33% of an initial pressure.
2 more elements
Dependencies are inferred from the claim text.