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US 7,679,916 B2Granted
Method and system for extracting heat from electrical components
AssigneeGE Intelligent Platforms Embedded Systems, Inc.
InventorsChris Erwin Orr, David S. Slaton
Life of this patent
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Abstract
A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.
Claims19
A system for extracting heat from an electronic device, said system comprising:
- an in-board heat sink structure positioned within a printed circuit board, said in-board heat sink structure comprising a microfluidic nano-tube system comprising a plurality of microfluidic nano-tubes;
- a ball grid array package attached to said printed circuit board, said ball grid array package comprising a plurality of solder balls attached to corresponding contact pads, said contact pads attached to corresponding vias that extend from the corresponding solder balls through a dielectric plane in the printed circuit board to a copper plane, at least one microfluidic nano-tube of the plurality of microfluidic nano-tubes embedded within the dielectric plane between adjacent vias;
- and
- a fluid heat transfer medium channeled through said in-board heat sink structure, wherein said fluid heat transfer medium flows into said in-board heat sink structure at a single entrance and circulates through said in-board heat sink structure carrying heat away from the electronic device.
1 more element
A method for extracting heat from an electronic device, the method comprising:
- positioning an in-board heat sink structure within a printed circuit board, the in-board heat sink structure including a plurality of interconnected microfluidic nano-tubes;
- attaching a ball grid array package to the printed circuit board, the ball grid array package comprising a plurality of solder balls attached to corresponding contact pads, the contact pads attached to corresponding vias that extend from the corresponding solder balls through a dielectric plane in the printed circuit board to a copper plane;
- embedding at least one microfluidic nano-tube of the plurality of interconnected microfluidic nano-tubes within the dielectric plane between adjacent vias;
- and
- channeling a fluid heat transfer medium through the in-board heat sink structure, wherein the fluid heat transfer medium enters the in-board heat sink structure through a single entrance and circulates through the in-board heat sink structure and into a heat sink.
2 more elements
A heat dissipation system comprising:
- a microfluidic nano-tube system positioned within a printed circuit board, said microfluidic nano-tube system comprising a plurality of interconnected microfluidic nano-tubes;
- a ball grid array package attached to said printed circuit board, said ball grid array package comprising a plurality of solder balls attached to corresponding contact pads, said contact pads attached to corresponding vias that extend from said corresponding solder balls through a dielectric plane in said printed circuit board to a copper plane, at least one microfluidic nano-tube of the plurality of interconnected microfluidic nano-tubes embedded within the dielectric plane between adjacent vias;
- and
- a fluid transfer medium channeled through said microfluidic nano-tube system, wherein said fluid transfer medium flows into said microfluidic nano-tube system at a single entrance and circulates through said microfluidic nano-tube system and into a heat sink.
1 more element
Dependencies are inferred from the claim text.