Motor control apparatus and method of assembling motor control apparatus
AssigneeKabushiki Kaisha Yaskawa Denki
InventorsKenji Isomoto, Shuhei Nohara, Shigekatsu Nagatomo
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Abstract
There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.
Claims13
A motor control apparatus comprising:
- a substrate;
- a heat sink;
- a power semiconductor module which adheres to the heat sink and is mounted on the substrate;
- and
- a spacer which is provided between the heat sink and the substrate, wherein the power semiconductor module is disposed in the spacer,
- a first engaging portion for attaching the spacer is provided on a side surface of the heat sink and a second engaging portion corresponding to the first engaging portion is provided on a side surface of the spacer, and
- the first and second engaging portions are engaged with each other in order to attach the spacer to the heat sink, and
- wherein the spacer is fabricated by an adiabatic resin and covers a surface of the heat sink, and an air layer forming concave portion is provided in at least a part of a contact surface with the surface of the heat sink.
A motor control apparatus comprising:
- a substrate;
- a heat sink;
- a power semiconductor module which adheres to the heat sink and is mounted on the substrate;
- and
- a spacer which is provided between the heat sink and the substrate, wherein
- the power semiconductor module is disposed in the spacer,
- a first engaging portion for attaching the spacer is provided on a side surface of the heat sink and a second engaging portion corresponding to the first engaging portion is provided on a side surface of the spacer, and
- the first and second engaging portions are engaged with each other in order to attach the spacer to the heat sink,
- wherein
- the power semiconductor module includes a terminal protruded from a side surface thereof, and
- wherein a convex portion of the spacer is disposed between the heat sink and the terminal of the power semiconductor module.
Dependencies are inferred from the claim text.