Camera module package

#This application claims the benefit of Korean Patent Application No. 10-2006-0044616 filed with the Korea Intellectual Property Office on May 18, 2006, the disclosure of which is incorporated herein by reference.

#1. Field of the Invention

#The present invention relates to a camera module package in which via holes and bumps are flip-chip-bonded so as to correspond to each other one to one. In the camera module package, when an image sensor is bonded to the lower surface of an FPCB (flexible printed circuit board) by a flip chip, via holes passing through the FPCB are formed in positions corresponding to connection bumps provided on the upper surface of the image sensor, thereby enhancing a degree of freedom in designing an FPCB.

#These and/or other aspects and advantages of the present general inventive concept will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

#FIG. 1 is an exploded perspective view of a conventional COF type camera module;

#FIG. 2 is a partial sectional view of the conventional COF type camera module of FIG. 1;

#Reference will now be made in detail to the embodiments of the present general inventive concept, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. The embodiments are described below in order to explain the present general inventive concept by referring to the figures.

#Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

#FIG. 4 is an assembled perspective view of a camera module package according to the invention when an image sensor is flip-chip-bonded, FIG. 5 is an enlarged sectional view taken along I-I line of FIG. 4, and FIG. 6 is a sectional view of the camera module package according to the invention.