Semiconductor device having symbol pattern utilized as identification sign
AssigneeFujitsu Microelectronics Limited
InventorsShigeki Yoshida, Fumio Ushida, Nobuhisa Naori, Yasutaka Ozaki
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Abstract
A plurality of device patterns constituting part of an electronic circuit are formed over the surface of a substrate. A symbol pattern to be used for an identification sign is formed in the same layer as the device patterns. A width of the device pattern is within a pattern width range on a design rule. The symbol pattern is formed by a plurality of isolated element patterns. The element pattern is either a linear pattern or a dot pattern. A width of the element pattern is equal to or larger than 0.8 time a lower limit value of the pattern width range and equal to or smaller than 1.2 times an upper limit value of the pattern width range.
Claims7
A semiconductor device comprising:
- a plurality of device patterns constituting part of an electronic circuit formed over a surface of a substrate;
- and
- a symbol pattern to be used for an identification sign formed in a same layer as the device patterns, the symbol pattern representing an original pattern corresponding to the identification sign;
- wherein the original pattern contains a straight line portion;
- and
- wherein a width of the device pattern is within a pattern width range on a design rule, the symbol pattern is formed by a plurality of isolated element patterns, each element pattern is a linear pattern, and a width of the element pattern is equal to or larger than 0.8 times a lower limit value of the pattern width range on the design rule and equal to or smaller than 1.2 times an upper limit value of the pattern width range on the design rule, the straight line portion of the original pattern is represented by at least two element patterns of the isolated element patterns, the two element patterns being disposed in parallel to each other.
A semiconductor device comprising:
- a plurality of device patterns constituting part of an electronic circuit formed over a surface of a substrate;
- and
- a symbol pattern to be used for an identification sign formed in a same layer as the device patterns, the symbol pattern representing an original pattern corresponding to the identification sign;
- wherein the original pattern contains a bending portion or a crossing portion;
- and
- wherein a width of the device pattern is within a pattern width range on a design rule, the symbol pattern is formed by a plurality of isolated element patterns, each element pattern is a linear pattern or a dot pattern, and a width of the element pattern is equal to or larger than 0.8 times a lower limit value of the pattern width range on the design rule and equal to or smaller than 1.2 times an upper limit value of the pattern width range on the design rule;
- and
- wherein the original pattern corresponding to the identification sign is represented by a shape of a region where a plurality of element patterns constituting the symbol pattern are not disposed.
Dependencies are inferred from the claim text.