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US 7,679,201 B2Granted
Device package
AssigneeIntel Corporation
InventorsRonald Frederick Barbee, Glenn Robertson, Robert Peene
Life of this patent
Estimating the term…
Abstract
A package includes a device and a package substrate. The device includes a plurality of electrical pads, and has a periphery that defines a footprint. The package substrate, further includes a first substrate surface to which the device is attached, a second substrate surface, and a set of electrical contacts attached to the second substrate surface.
Claims22
A package comprising:
- a device including:
- a plurality of electrical pads;
- and
- having a periphery that defines a footprint;
- a package substrate including:
- a first substrate surface to which the device is attached;
- a second substrate surface;
- and
- a set of electrical contacts attached to the second substrate surface, wherein the electrical contacts below a footprint of the device are not electrically coupled to the electrical pads of the device, and wherein none of the electrical contacts outside the footprint of the device are not electrically coupled to the electrical pads of the device.
6 more elements
A package substrate comprising:
- a plurality of pads on one surface;
- an area adapted to receive a device, the area corresponding to an outer periphery of a device defining a shadow area;
- a plurality of electrical contacts on another surface;
- and
- conductive pathways electrically connecting at least a portion of the plurality of pads to at least a portion of the plurality of electrical contacts, wherein the electrical contacts within the shadow area are adapted to be unconnected to a die, and wherein none of the electrical contacts outside the shadow area are adapted to be unconnected to the die.
2 more elements
A computer system comprising:
- a package comprising:
- a device including:
- a plurality of electrical pads;
- and
- having a periphery that defines a footprint;
- a package substrate including:
- a first substrate surface to which the device is attached;
- and
- a second substrate surface;
- and
- a set of electrical contacts attached to the second substrate surface, wherein the electrical contacts below a footprint of the device are not electrically connected to the electrical pads of the device, and wherein none of the electrical contacts outside the footprint of the device are not electrically coupled to the electrical pads of the device;
- and
- a display communicatively coupled to the package.
10 more elements
Dependencies are inferred from the claim text.