Semiconductor chip with crack stop
AssigneeGlobalfoundries Inc.
InventorsMichael Z. Su, Jaime Bravo, Lei Fu, Jun Zhai
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Abstract
Various semiconductor chip crack stops and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor substrate that has a first corner defined by a first edge and a second edge. A crack stop is formed in the semiconductor substrate. The crack stop includes a first projection extending to the first edge and a second projection extending to the second edge to fence off a portion of the semiconductor substrate that includes the first corner.
Claims20
A method of manufacturing, comprising:
- providing a semiconductor substrate that includes a first principal surface and a second and opposite principal surface and a first corner defined by a first edge and a second edge;
- and
- forming a crack stop in the semiconductor substrate that does not project beyond the first principal surface and includes a first projection extending to the first edge and a second projection extending to the second edge to fence off a portion of the semiconductor substrate including the first corner.
A method of manufacturing, comprising:
- providing a rectangular semiconductor substrate that includes a first principal surface and a second and opposite principal surface, a first edge, a second edge, a third edge and a fourth edge that define a first corner, a second corner, a third corner and a fourth corner;
- and
- forming a crack stop in the semiconductor substrate that does not project beyond the first principal surface and includes a first projection, a second projection, a third projection, a fourth projection, a fifth projection, a sixth projection, a seventh projection and an eighth projection, the first projection extending to the first edge and the second projection extending to the second edge to fence off a portion of the semiconductor substrate including the first corner, the third projection extending to the second edge and the fourth projection extending to the third edge to fence off a portion of the semiconductor substrate including the second corner, the fifth projection extending to the third edge and the sixth projection extending to the fourth edge to fence off a portion of the semiconductor substrate including the third corner, the seventh projection extending to the fourth edge and the eighth projection extending to the first edge to fence off a portion of the semiconductor substrate including the fourth corner.
A semiconductor chip, comprising:
- a semiconductor substrate that includes a first principal surface and a second and opposite principal surface and a first corner defined by a first edge and a second edge;
- and
- a crack stop in the semiconductor substrate that does not project beyond the first principal surface and includes a first projection extending to the first edge and a second projection extending to the second edge to fence off a portion of the semiconductor substrate including the first corner.
Dependencies are inferred from the claim text.