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US 7,679,196 B2Granted
Stacked mounting structure
AssigneeOlympus Corporation
InventorsTakanori Sekido, You Kondoh
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AssigneeOlympus Corporation
InventorsTakanori Sekido, You Kondoh
Estimating the term…
A stacked mounting structure includes at least two substrates namely a first substrate on which a first protruding electrode is formed and a second substrate on which a second protruding electrode is formed, and an intermediate substrate which is disposed between the first substrate and the second substrate, and which connects the first substrate and the second substrate by leaving a predetermined gap between the first substrate and the second substrate. Mounted components are disposed in the gap between the first substrate and the second substrate. The first protruding electrode and the second protruding electrode are connected in an opening which is provided in the intermediate substrate.
A stacked mounting structure comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
No references of this kind are recorded.
Packaging processes not covered by the other groups of this subclass
Processes for packaging MEMS devices: connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
Processes for packaging MEMS devices: aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
Structural association of two or more printed circuits: stacked arrangements of planar printed circuit boards
About 1 year 6 months of term left · ends 3 May 2028 (estimated)
The present application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2005-370157 filed on Dec. 22, 2005; the entire contents of which are incorporated herein by reference.
1. Field of the Invention
The present invention relates to a stacked mounting structure, and particularly to a three-dimensional stacked mounting structure which is made by stacking a plurality of members in a directions of thickness of the members.
FIG. 1 is a diagram showing a cross-sectional view of a stacked mounting structure according to a first embodiment of the present invention;
FIG. 2 is a diagram showing a perspective view of the disassembled stacked mounting structure of the first embodiment;
FIG. 3 is a diagram showing a cross-sectional view of a stacked mounting structure according to a second embodiment of the present invention;
Embodiments of a stacked mounting structure according to the present invention will be described below in detail with reference to the accompanying diagrams. However, the present invention is not restricted to the embodiments which will be described below.
A stacked mounting structure 100 according to a first embodiment of the present invention will be described below. FIG. 1 shows a cross-sectional view of the stacked mounting structure 100. FIG. 2 shows a perspective view of the disassembled stacked mounting structure 100.
In FIG. 1, each of a first substrate 101a and a second substrate 101b is in a flat plate form. A substrate such as an organic substrate, a ceramic substrate, a glass substrate, a Si substrate, a metal substrate, and a flexible substrate can be used for these two substrates 101a and 101b. Moreover, it is also possible to use a composite material substrate in which these substrates are combined. The first substrate 101a corresponds to a first member. The second substrate 101b corresponds to a second member.