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US 7,679,193 B2Granted
Use of AIN as cooper passivation layer and thermal conductor
AssigneeMicron Technology, Inc.
InventorAllen McTeer
Life of this patent
Estimating the term…
Abstract
A copper interconnect structure is disclosed as comprising a copper layer and an aluminum nitride layer formed over the copper layer. The aluminum nitride layer passivates the copper layer surface and enhances the thermal conductivity of a semiconductor substrate by radiating heat from the substrate as well as from the copper layer.
Claims11
An interconnect structure providing electrical connection in a semiconductor device, the interconnect structure comprising:
- a first conductive plug;
- a plurality of second conductor plugs stacked over the first conductor plug, the first conductive plug being electrically coupled to a first of the second conductor plugs;
- a plurality of passivation material regions comprising aluminum nitride, each one of the passivation material regions being in contact with a top surface of one of the second conductor plugs;
- and
- a plurality of barrier material regions, each one of the barrier material regions formed on a bottom surface of one of the second conductor plugs.
2 more elements
An integrated circuit containing a copper interconnect structure, the copper interconnect structure comprising:
- a conductive plug;
- a plurality of copper material regions stacked over the first conductor plug, the conductive plug being electrically coupled to a first of the copper material regions;
- a plurality of heat-radiating passivation material regions, each one of the passivation material regions being in contact with a top surface of one of the copper material regions;
- and
- a plurality of barrier material regions, each one of the barrier material regions being formed between one of the copper material regions and one of the passivation material regions or the conductive plug, the passivation material regions comprising a substantially continuous region of aluminum nitride and being approximately 100 Å to approximately 1000 Å thick.
2 more elements
Dependencies are inferred from the claim text.