Display device and manufacturing method of the same
AssigneeHitachi Displays, Ltd.
InventorsHideaki Abe, Makoto Sato, Mitsuru Goto
Life of this patent
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Abstract
A display device includes a drive circuit chip, and a substrate on which the drive circuit chip is mounted. The drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer. The first bump is superposed with the first conductive layer, and a profile of the first bump in plan view is within a profile of the first conductive layer in plan view. The second bump is superposed with the second conductive layer, and a profile of the second pump in plan view is beyond a profile of the second conductive layer in plan view.
Claims28
A display device comprising:
- a drive circuit chip;
- and
- a substrate on which the drive circuit chip is mounted;
- wherein the drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer;
- wherein the first bump is superposed and electrically connected with the first conductive layer, and a profile of the first bump in plan view is within a profile of the first conductive layer in plan view;
- wherein the second bump is superposed and electrically connected with the second conductive layer, and a profile of the second bump in plan view is beyond a profile of the second conductive layer in plan view;
- and
- wherein the second bump is positioned at a corner portion of the drive circuit chip.
A display device comprising:
- a drive circuit chip;
- and
- a substrate on which the drive circuit chip is mounted:
- wherein the drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer;
- wherein the first bump is superposed and electrically connected with the first conductive layer, and all peripheral edges of a bottom surface of the first bump, which faces the insulation layer, are superposed with the first conductive layer;
- wherein the second bump is superposed and electrically connected with the second conductive layer, and all peripheral edges of a bottom surface of the second bump, which faces the insulation layer, are not superposed with the second conductive layer;
- and
- wherein the second bump is positioned at a corner portion of the drive circuit chip.
A display device according to clam 10, wherein the first bump is an output bump, and the second bump is an alignment bump.
A display device comprising:
- a drive circuit chip;
- and
- a substrate on which the drive circuit chip is mounted;
- wherein the drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer;
- the second bump has a larger size than the first bump in plan view;
- wherein the first bump is superposed and electrically connected with the first conductive layer, and a profile of the first bump in plan view is within a profile of the first conductive layer in plan view;
- and
- wherein the second bump is superposed and electrically connected with the second conductive layer, and a profile of the second bump in plan view is beyond a profile of the second conductive layer in plan view.
Dependencies are inferred from the claim text.