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US 7,679,184 B2Granted
Semiconductor device having high cooling efficiency and method for manufacturing the same
AssigneeSony Computer Entertainment Inc.
InventorsHidetoshi Kusano, Kazuaki Yazawa
Life of this patent
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Abstract
A semiconductor device includes a substrate, a semiconductor chip flip-chip mounted on the substrate, a sealing resin layer sealing the surroundings of the semiconductor chip, and a heat sink bonded to the sealing resin layer through a TIM layer. In addition, a cooling medium is encapsulated in an enclosed space formed on the rear surface of the semiconductor chip.
Claims7
A semiconductor device comprising:
- a substrate;
- a semiconductor chip which is mounted on the substrate with a front surface of the semiconductor chip facing downward;
- a sealing resin layer which seals the semiconductor chip;
- a cooling member which is bonded to an upper surface of the sealing resin layer;
- a cavity enclosed by at least a lower surface of the cooling member and a rear surface of the semiconductor chip which is exposed on the sealing resin layer;
- and
- a liquid cooling medium which is encapsulated in the cavity, wherein
- the rear surface of the semiconductor chip is positioned lower than an uppermost surface of the sealing resin layer and wherein at least a part of the upper surface of the sealing resin layer is inclined toward the rear surface of the semiconductor chip, and
- an upper surface of the liquid cooling medium is positioned lower than a level of the uppermost surface of the sealing resin layer when the semiconductor device is horizontally placed.
6 more elements
A semiconductor device comprising:
- a substrate;
- a semiconductor chip which is mounted on the substrate with a front surface of the semiconductor chip facing downward;
- a sealing resin layer which seals the semiconductor chip;
- a cooling member which is bonded to an upper surface of the sealing resin layer;
- a cavity enclosed by at least a lower surface of the cooling member and a rear surface of the semiconductor chip which is exposed on the sealing resin layer;
- and
- a liquid cooling medium which is encapsulated in the cavity, wherein a bottom surface of the cavity includes the rear surface of the semiconductor chip and a part of the upper surface of the sealing resin layer which is located around the rear surface of the semiconductor chip.
4 more elements
Dependencies are inferred from the claim text.