Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof

A semiconductor package on which a semiconductor device can be stacked, comprising:

• a substrate having a plurality of first bonding pads and second bonding pads;
• at least a semiconductor chip mounted on the substrate;
• a plurality of first electrical connecting elements electrically connecting the semiconductor chip and the first bonding pads of the substrate;
• an electrical connecting structure mounted on the substrate, wherein the electrical connecting structure consists of at least one upper layer circuit board and at least one lower layer circuit board electrically connected thereto, a receiving space is formed in the electrical connecting structure so as to receive the semiconductor chip and the plurality of first electrical connecting elements therein, the first bonding pads of the substrate are configured in the area covered by the electrical connecting structure, and the second bonding pads are configured outside the area covered by the electrical connecting structure;
• a plurality of second electrical connecting elements for electrically connecting the lower layer circuit board and the second bonding pads of the substrate so as to electrically connecting the electrical connecting structure to the substrate;
• and
• an encapsulant formed on the substrate for encapsulating the semiconductor chip, the plurality of first electrical connecting elements, the electrical connecting structure and the plurality of second electrical connecting elements, wherein an upper surface of the upper layer circuit board is exposed from the encapsulant.