Back to results
US 7,679,177 B2Granted
Integrated circuit packaging system with passive components
AssigneeSTATS ChipPAC, Ltd.
InventorKi Youn Jang
Life of this patent
Estimating the term…
Abstract
An integrated circuit packaging system comprising: fabricating a system-in-package substrate; mounting a first integrated circuit die on the system-in-package substrate; mounting a second integrated circuit die on the system-in-package substrate; and coupling a passive component over and between the first integrated circuit die and the second integrated circuit die.
Claims20
A method of manufacturing an integrated circuit packaging system comprising:
- fabricating a system-in-package substrate;
- connecting a first passive component on the system-in-package substrate;
- mounting a first integrated circuit die, adjacent to the first passive component, on the system-in-package substrate;
- mounting a second integrated circuit die on the system-in-package substrate;
- and
- coupling a passive component over and between the first integrated circuit die and the second integrated circuit die.
3 more elements
A method of manufacturing an integrated circuit packaging system comprising:
- fabricating a system-in-package substrate having contact pads;
- connecting a first passive component on the contact pads;
- mounting a first integrated circuit die, adjacent to the first passive component, on the system-in-package substrate including applying an adhesive on the system-in-package substrate;
- mounting a second integrated circuit die on the system-in-package substrate;
- and
- coupling a passive component over and between the first integrated circuit die and the second integrated circuit die.
3 more elements
An integrated circuit packaging system comprising:
- a system-in-package substrate;
- a first passive component on the system-in-package substrate;
- a first integrated circuit die mounted on the system-in-package substrate adjacent to the first passive component;
- a second integrated circuit die mounted on the system-in-package substrate;
- and
- a passive component coupled over and between the first integrated circuit die and the second integrated circuit die.
3 more elements
Dependencies are inferred from the claim text.