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US 7,679,169 B2Granted
Stacked integrated circuit leadframe package system
AssigneeSTATS ChipPAC, Ltd.
InventorChoong Bin Yim
Life of this patent
Estimating the term…
Abstract
A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an opposite side of the leadframe, and forming external electrical interconnects on the leadframe.
Claims10
A stacked integrated circuit leadframe package system comprising:
- a flat leadframe;
- a top integrated circuit packaged on a one side of the leadframe;
- a bottom integrated circuit packaged on an opposite side of the leadframe;
- an encapsulant over the bottom integrated circuit with the encapsulant having vertical sides;
- and
- solder balls on the leadframe, the solder balls having vertical sides abutting the vertical sides of the encapsulant.
3 more elements
An integrated circuit leadframe package system comprising:
- a flat leadframe;
- a top integrated circuit on a one side of the leadframe, the top integrated circuit electrically connected to the one side of the leadframe and the top integrated circuit encapsulated with the one side of the leadframe;
- a bottom integrated circuit on an opposite side of the leadframe, the bottom integrated circuit connected to the opposite side of the leadframe and the bottom integrated circuit encapsulated with the opposite side of the leadframe;
- an encapsulant over the bottom integrated circuit with the encapsulant having vertical sides;
- and
- solder balls on the leadframe, the solder balls having vertical sides abutting the vertical sides of the encapsulant.
3 more elements
Dependencies are inferred from the claim text.