Electronic assembly for image sensor device and fabrication method thereof
AssigneeVisEra Technologies Company Limited
InventorsTeng-Sheng Chen, Pai-Chun Peter Zung, Tzu-Han Lin, Shin-Chang Shiung
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Abstract
A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
Claims28
A package module for an image sensor device, comprising:
- a lower substrate and an upper substrate opposite thereto;
- a device chip disposed between the lower and upper substrates;
- a first conductive layer over a first sidewall of the lower substrate, insulated from the device chip;
- a first protective layer on the first conductive layer, exposing a portion of the first conductive layer over the first sidewall of the lower substrate;
- and
- a first pad on the bottom surface of the lower substrate, electrically connected to the first conductive layer.
An electronic assembly for an image sensor device, comprising:
- a package module, comprising:
- a lower substrate and an upper substrate opposite thereto;
- a device chip disposed between the lower and upper substrates;
- a first conductive layer over a first sidewall of the lower substrate, insulated from the device chip unless the first conductive layer is electrically connected to a printed circuit board;
- a first protective layer on the first conductive layer, exposing a portion of the first conductive layer over the first sidewall of the lower substrate;
- and
- a first pad on the bottom surface of the lower substrate, electrically connected to the first conductive layer;
- a lens set mounted on the package module;
- and
- an opaque conductive layer disposed on the sidewall of the lens set and electrically connected to the first conductive layer.
A method for fabricating an electronic assembly for an image sensor device, comprising:
- providing a package module, comprising:
- a lower substrate and an upper substrate opposite thereto;
- a device chip disposed between the lower and upper substrates;
- a first conductive layer over a first sidewall of the lower substrate, insulated from the device chip;
- a first protective layer on the first conductive layer;
- and
- a first pad on the bottom surface of the lower substrate, electrically connected to the first conductive layer;
- partially removing the first protective layer to expose a portion of the first conductive layer over the first sidewall of the lower substrate;
- mounting a lens set onto the package module;
- forming an opaque conductive layer on the sidewall of the lens set and directly on the exposed portion of the first conductive layer;
- and
- mounting the package module with the lens set on a printed circuit board comprising a grounding pad therein.
Dependencies are inferred from the claim text.