Solid state imaging device and solid state imaging element
AssigneeFunal Electric Co., Ltd.
InventorsHiromichi Tanaka, Hideto Yoshimura, Sumio Terakawa, Masafumi Kimata
Life of this patent
Estimating the term…
Loading patent…
AssigneeFunal Electric Co., Ltd.
InventorsHiromichi Tanaka, Hideto Yoshimura, Sumio Terakawa, Masafumi Kimata
Estimating the term…
Each of three light receiving sections has a P-type well having a P+-type layer and an N-type layer formed therein. The P+-type layer is diffused from substrate surface to depth d1. A PN junction forming portion of the N-type layer is diffused from depth d1 to depth d2 which is greater than depth d1 so as to form, with the P-type well, a PN junction of a photodiode at depth d2. Depths d1 as well as depths d2 of the three light receiving sections are different from each other. The N-type layer has a charge output portion which is diffused from the PN junction to the substrate surface, and which is coupled by circuit coupling to a MOS transistor for reading out charge. This allows each light receiving section to have spectral characteristics, thereby providing a solid state imaging element and a solid state imaging device without using color filters.
A solid state imaging device comprising:
A solid state imaging device comprising:
A solid state imaging element comprising a plurality of kinds of light receiving sections for photoelectrically converting incident light to generate charge, each of the light receiving sections comprising:
Dependencies are inferred from the claim text.