Micromechanical device and method for manufacturing a micromechanical device

#This application claims priority from German Patent Application No. 10 2006 004 209.3, which was filed on Jan. 30, 2006, and is incorporated herein by reference in its entirety.

#The present invention relates to a micromechanical device and to a method for manufacturing a micromechanical device, in particular to a micromechanical device having a region for forming integrated circuits, i.e., for example, micromechanical sensors, such as, for example, integrated pressure sensors or integrated acceleration sensors.

#In surface micromechanics, there is a possibility, when manufacturing integrated sensor elements, to produce cavities for such devices along with other electrical devices in an integrated circuit. Thus, the process steps for manufacturing the micromechanics components (micromechanics process steps) are partly of considerable influence for the characteristics of the electrical devices processed. One consequence frequently resulting is a limitation in the degrees of freedom in the process management for manufacturing and sealing cavities in these devices. The result is that disadvantages in the characteristics of the micromechanical devices partly have to be put up with. An example of such a limitation or a disadvantage in the characteristics of such a micromechanical device is that it might be of particular importance, in particular in modern processes and devices, for the doping profiles provided not to be shifted.

#Preferred embodiments of the present invention will be detailed subsequently referring to the appended drawings, in which:

#FIGS. 1a-1d show a schematic illustration of the inventive method for manufacturing a micromechanical device;

#FIGS. 2a-2c show a schematic illustration of a prior method for manufacturing a micromechanical device; and

#According to an embodiment, a method for manufacturing a micromechanical device having a region for forming an integrated circuit, may have the steps of: producing a recess in a substrate; producing a first layer in the recess; producing a membrane layer on the first layer; introducing at least one channel into the membrane layer, the channel completely penetrating the membrane layer; removing a region of the first layer below the membrane layer to form a cavity; sealing the at least one channel; and forming a planar surface, wherein the first layer and the membrane layer are produced in the recess such that the cavity is located in the recess.

#According to another embodiment, a micromechanical device having a region for forming an integrated circuit, may comprise: a recess in the substrate; a first layer in the recess; a membrane layer on the first layer, the membrane layer covering a cavity in the first layer; and a planar surface, wherein the region for forming the integrated circuit is outside a region in which the membrane layer is formed; and wherein the first layer and the cavity are located in the recess.

#According to another embodiment, a method for manufacturing a micromechanical device having a region for forming an integrated circuit, may have: producing a first layer on a substrate; producing a membrane layer on the first layer; introducing at least one channel into the membrane layer, the channel completely penetrating the membrane layer; removing a region of the first layer below the membrane layer to form a cavity; sealing the at least one channel; and forming a planar surface.