Low thermal resistance high power LED
AssigneeAvago Technologies ECBU IP (Singapore) Pte. Ltd.
InventorSiew It Pang
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Abstract
A light source having a circuit carrier and a die is disclosed. The circuit carrier includes top and bottom conducting layers sandwiching an insulating substrate. The bottom layer has a first surface adjacent to the insulating substrate and a second surface includes a portion of a bottom surface of the light source, the substrate having a die bonding region in which the top conducting layer and a portion of the substrate are absent. A portion of the bottom conducting layer is present under the die bonding region and the die is bonded to the top surface of the bottom conducting layer in the die bonding region. The bottom conducting layer is patterned to provide first and second bottom electrodes that are electrically isolated from one another and connected to first and second contacts for powering the LED.
Claims9
A light source comprising:
- a circuit carrier comprising top and bottom conducting layers sandwiching an insulating substrate, said bottom conducting layer having a top surface, a bottom surface, and first and second electrodes that are electrically isolated from each other, wherein a first portion of said top surface of said bottom conducting layer is adjacent to said insulating substrate, and a second portion of said top surface of said bottom conducting layer comprises a die bonding region in which said top conducting layer and said insulating substrate are absent, thereby exposing said top surface of said bottom conducting layer;
- and
- a die comprising a wire-bonded LED, said die comprising a bottom surface that is bonded to said top surface of said bottom conducting layer in said die bonding region, said die comprising first and second contacts extending therefrom for powering said LED, said first and second contacts being electrically connected to said first and second electrodes of said bottom conducting layer.
Dependencies are inferred from the claim text.