Metrology system of fine pattern for process control by charged particle beam
AssigneeHitachi High-Technologies Corporation
InventorsHiromasa Yamanashi, Muneyuki Fukuda, Sayaka Tanimoto, Yasunari Sohda
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AssigneeHitachi High-Technologies Corporation
InventorsHiromasa Yamanashi, Muneyuki Fukuda, Sayaka Tanimoto, Yasunari Sohda
Estimating the term…
The present invention provides a pattern inspection technique that enables measurement and inspection of a fine pattern by a charged particle beam to be performed with high throughput. A metrology system of fine pattern according to the pattern inspection technique has: a the column that includes a charged particle source, an electron optics for scanning a desired observation area on a sample with a charged particle beam emitted from the charged particle source, and a detector for detecting charged particles generated secondarily from the sample scanned by the charged particle beam; information processing means for measuring information about geometry of a pattern formed on the sample based on information on the intensity of the charged particles obtained by the detector; and a sample introduction unit for introducing the sample into the inside of the column; wherein a charge neutralizer unit for generating ions and charge neutralizing the sample with the ions and surface potential measuring means for measuring a surface potential of the sample surface are provided on a path that is inside the sample introduction unit and transports the sample to the column.
A metrology system of fine pattern for process control by charged particle beam, comprising:
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