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US 7,679,042 B1Granted
Fabrication of transducer structures
OwnerAllen M. Flusberg, Michael A. Huffinventors
Life of this patent
Estimating the term…
Abstract
Methods for fabricating structures such as transducer pedestal structures and transducers fabricated by the methods.
Claims13
A method for fabricating a pixellated transducer absorbing electromagnetic radiation in a predetermined range of wavelengths, the method comprising the steps of:
- bonding a wafer of a second predetermined material to a surface of a wafer of a first predetermined material;
- lapping and polishing to a first predetermined thickness the wafer of said second predetermined material;
- the lapped and polished wafer of said second predetermined material comprising a layer of said second predetermined material;
- patterning the layer of said second predetermined material according to a predetermined pattern;
- refilling the patterned layer of said second predetermined material with a sacrificial material;
- planarizing an exposed surface of the refilled patterned layer of said second predetermined material;
- depositing on a surface of a first wafer of a third predetermined material a first polymer layer of a second predetermined thickness;
- depositing on a surface of a second wafer of said third predetermined material a second polymer layer of a third predetermined thickness;
- said first polymer layer and said second polymer layer absorbing electromagnetic radiation in a predetermined range of wavelengths;
- disposing the first polymer layer deposited surface of the first wafer on the second polymer layer deposited surface of the second wafer;
- adhering the first polymer layer to the second polymer layer;
- said first wafer, said first polymer layer, said second polymer layer and said second wafer comprising a layered structure;
- patterning the layered structure with another predetermined pattern;
- and
- removing the sacrificial layer.
12 more elements
A pixellated transducer fabricated by the method of:
- bonding a wafer of a second predetermined material to a surface of a wafer of a first predetermined material;
- lapping and polishing to a first predetermined thickness the wafer of said second predetermined material;
- the lapped and polished wafer of said second predetermined material comprising a layer of said second predetermined material;
- patterning the layer of said second predetermined material according to a predetermined pattern;
- refilling the patterned layer of said second predetermined material with a sacrificial material;
- planarizing an exposed surface of the refilled patterned layer of said second predetermined material;
- depositing on a surface of a first wafer of a third predetermined material a first polymer layer of a second predetermined thickness;
- depositing on a surface of a second wafer of said third predetermined material a second polymer layer of a third predetermined thickness;
- said first polymer layer and said second polymer layer absorbing electromagnetic radiation in a predetermined range of wavelengths;
- disposing the first polymer layer deposited surface of the first wafer on the second polymer layer deposited surface of the second wafer;
- adhering the first polymer layer to the second polymer layers;
- said first wafer, said first polymer layer, said second polymer layer and said second wafer comprising a layered structure;
- patterning the layered structure with another predetermined pattern;
- pixelation being obtained by said patterning of the polymer layer;
- and
- removing the sacrificial layer;
- said patterning of the layer of said another predetermined material and said removing the sacrificial material providing structural supports between each pixel and said wafer of said predetermined material.
14 more elements
A method for fabricating a pixellated transducer absorbing electromagnetic radiation in a predetermined range of wavelengths, the method comprising the steps of:
- depositing an antireflection (AR) coating on a surface of a wafer of a first predetermined material;
- bonding a wafer of a second predetermined material to the surface of the wafer of the first predetermined material;
- lapping and polishing to a first predetermined thickness the wafer of said second predetermined material;
- the lapped and polished wafer of said second predetermined material comprising a layer of said second predetermined material;
- patterning the layer of said second predetermined material according to a predetermined pattern;
- refilling the patterned layer of said second predetermined material with a sacrificial material;
- planarizing an exposed surface of the refilled patterned layer of said second predetermined material;
- depositing on a surface of a first wafer of a third predetermined material a first polymer layer of a second predetermined thickness;
- depositing on a surface of a second wafer of said third predetermined material a second polymer layer of a third predetermined thickness;
- said first polymer layer and said second polymer layer absorbing electromagnetic radiation in a predetermined range of wavelengths;
- disposing the first polymer layer deposited surface of the first wafer on the second polymer layer deposited surface of the second wafer;
- adhering the first polymer layer to the second polymer layer;
- said first wafer, said first polymer layer, said second polymer layer and said second wafer comprising a layered structure;
- patterning the layered structure with another predetermined pattern;
- and
- removing the sacrificial layer.
13 more elements
Dependencies are inferred from the claim text.