Keypad assembly for electronic device

#1. Field of the Invention

#The present invention generally relates to keypad assemblies, specifically to a keypad assembly for an electronic device, such as a mobile phone.

#2. Description of Related Art

#Many aspects of the present keypad assembly can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present keypad assembly. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

#FIG. 1 is an exploded, isometric view of a keypad assembly, in accordance with an exemplary embodiment.

#FIG. 2 is similar to FIG. 1, but viewed from another aspect.

#The present keypad assembly is suitable for electronic devices, such as mobile phones, personal digital assistants (PDAs), and etc.

#Referring to FIGS. 1 and 2, a keypad assembly 100 includes a pressing surface layer 10, a pattern layer 20, a first adhesive layer 30, an elastic layer 40, a second adhesive layer 50, a light guiding layer 60, a third adhesive layer 70 and a pressing bottom layer 80.

#The pressing surface layer 10 can be made of transparent and elastic thermoplastic macromolecule materials such as rubber, thermoplastic polyurethane or a combination thereof. A thickness of the pressing surface layer 10 is in the range of about 0.1-about 0.2 mm (millimeter) and is preferably about 0.2 mm. The pressing surface layer 10 has a top surface 12 and an opposite bottom surface 14. The top surface 12 has a plurality of key profiles 122 formed thereon. The profiles 122 may protrude from the top surface 12 or may be recessed in top surface 12. In the exemplary embodiment, the profiles 122 protrude from the top surface 12. Each profile 122 can be substantially ring-shaped. A thickness of the profile 122 is in the range of about 0.2-about 0.3 mm and is preferably about 0.2 mm. The profiles 122 can be formed by hot press molding. The location of the profiles 122 on the pressing surface layer 10 identify the locations of keys formed on the keypad assembly 100.