Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same

A circuitized substrate comprising:

• a dielectric member;
• a plurality of signal conductors spacedly positioned within said dielectric member;
• at least one conductive thru-hole having at least two ends and disposed within said dielectric member and extending substantially between at least two of said signal conductors;
• and
• a plurality of shielding members forming a solid, conductive wall and strategically positioned within said dielectric member so as to substantially entirely surround said plurality of signal conductors including said at least two of said signal conductors between which said at least one conductive thru-hole extends, said solid wall of said plurality of shielding members providing shielding for high frequency signals passing through said plurality of signal conductors and said at least one conductive thru-hole during operation of said circuitized substrate, whereby said at least one conductive thru-hole is shielded along the entire length and said at least two ends thereof.