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US 7,678,999 B2Granted
Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance
AssigneeTanaka Denshi Kogyo K.K.
InventorsKazunari Maki, Yuji Nakata
Life of this patent
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Abstract
A gold alloy wire for a bonding wire contains one kind or two kinds of Pt and Pd of 5000 ppm to 2% by mass in total, Ir: 1 to 200 ppm, Ca: 20 to 200 ppm, Eu: 10 to 200 ppm, Be: 0.1 to 30 ppm, if necessary, and La: 10 to 200 ppm, if necessary. At least two kinds of Ca, Eu, Be, and La are in a range of 50 to 250 ppm in total.
Claims7
A gold alloy wire for a bonding wire having high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance, the gold alloy wire comprising:
- a component composition comprising at least one kind of Pt and Pd of 5000 ppm to 2% by mass in total, Ir:
- 1 to 200 ppm, Ca:
- 20 to 200 ppm, Eu:
- 10 to 200 ppm, and the balance being Au and inevitable impurities.
1 more element
Dependencies are inferred from the claim text.