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AssigneeSamsung Electronics Co., Ltd.
InventorsJung-Dae Park, Sang-Eon Lee, Sang-Mun Chon, Yang-Koo Lee, Dong-Chul Heo, Pil-Kwon Jun
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Disclosed are a composition for removing photoresist, a method of removing photoresist and a method of manufacturing a semiconductor device using a composition. The composition may include a ketone compound and a first polar aprotic solvent. The composition may also include the ketone compound and a second polar aprotic solvent. Moreover, the composition may include the first polar aprotic solvent and a second polar aprotic solvent with or without the ketone compound. The first polar aprotic solvent has at least one of an ether compound and an ester compound, and the second polar aprotic solvent has at least one of a sulfur-containing compound and a nitrogen-containing compound.
A method of removing photoresist comprising:
A method of removing photoresist comprising:
A method of removing photoresist comprising:
A method of removing photoresist comprising:
A method of removing photoresist comprising:
A method of removing photoresist comprising:
A method of removing photoresist comprising:
A method of manufacturing a semiconductor device comprising:
A method of manufacturing a semiconductor device comprising:
A method of manufacturing a semiconductor device comprising:
A method of manufacturing a semiconductor device comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
No references of this kind are recorded.
Containing oxygen: aldehydes; Ketones; Acetals or ketals
Organic solvents: containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
Organic solvents: containing nitrogen
Organic solvents: containing oxygen
About 2 years 3 months of term left · ends 13 Jan 2029 (estimated)
This application claims priority under 35 USC § 119 to Korean Patent Application No. 2004-101679 filed on Dec. 6, 2004, the contents of which are herein incorporated by reference in its entirety.
1. Field of the Invention
The present invention relates to a composition for removing photoresist, a method of removing photoresist and a method of manufacturing a semiconductor device using the same.
The above and other features and advantages of the present invention will become more apparent by describing in detailed example embodiments thereof with reference to the accompanying drawings, in which:
FIGS. 1 to 4 are cross-sectional views illustrating a method of manufacturing a semiconductor device in accordance with an embodiment of the present invention;
FIGS. 5 to 16 are cross-sectional views illustrating a method of manufacturing a semiconductor device in accordance with a further embodiment of the present invention;
The invention is described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity.
It will be understood that when an element or layer is referred to as being “on,” “connected to” or “coupled to” another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to” or “directly coupled to” another element or layer, there are no intervening elements or layers present. Like numbers refer to like elements throughout. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.