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US 7,678,711 B2Granted
Semiconductor device, and method and apparatus for manufacturing the same
AssigneeFujitsu Microelectronics Limited
InventorsMitsuaki Hori, Hiroyuki Ohta, Katsuaki Ookoshi
Life of this patent
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Abstract
A SiO2 film is formed on a semiconductor substrate. Then, a SiN film is formed on the SiO2 film. In this event bis(tertiary butyl amino) silane and NH3 are used as a material gas, and the film forming temperature is set to 600° C. or lower.
Claims6
A method for manufacturing a semiconductor device, comprising the steps of
- forming a gate insulation film over a semiconductor substrate;
- performing post-annealing on the gate insulation film;
- and
- forming a conductive film over the gate insulation film,
- said step of forming the gate insulation film comprising the steps of forming a first insulation film, and forming over the first insulation film a second insulation film composed of a nitride or an oxynitride using a material gas containing carbon, wherein
- said step of performing the post-annealing comprises the steps of:
- performing a first annealing in an atmosphere selected from at least one of the group consisting of an oxidizing atmosphere and an oxynitriding atmosphere at a first temperature;
- and
- performing a second annealing in a nitriding atmosphere at a second temperature higher than the first temperature,
- further comprising, between said step of forming the first insulation film and said step of forming the second insulation film, the step of forming a high dielectric constant film over the first insulation film, and
- the second insulation film is formed over the high dielectric constant film.
8 more elements
Dependencies are inferred from the claim text.